Source: Dongguan Huidia Electronic Technology Co., Ltd. Technical Center | Published: July 2026
AI servers (e.g., NVIDIA B200, H200) have been selling like crazy in recent years, driving upgrades across the entire SMT (Surface Mount Technology) production line. Compared to ordinary servers, AI server motherboards are larger and heavier—up to 1.2 meters long, with substantial thickness and component weight—and densely packed with tiny components (008004 size). This places higher demands on printing, placement, inspection, and conveyor equipment on the SMT line. The equipment investment for an AI server production line is roughly twice that of a standard server line.
So, how much market share have domestic SMT equipment manufacturers captured in this wave? Let's break it down by four key stages.
1. Solder Paste Printing: Domestic Players Already Lead, Feast on AI Server Orders
The solder paste printer is the first step in SMT, essentially "applying glue" to the PCB board. In this segment, Chinese manufacturer Kaige Precision is already the global leader in sales volume. According to public research reports from Dongwu Securities and others, Kaige held 21.2% of the global market share in 2024, surpassing ASMPT (18.9%) and ITW (16.4%). Domestically, it commands over 60% of the market.
Why is it so important for AI servers? AI servers require extremely high printing precision (5–8 microns), necessitating top-tier "Class III" machines, each priced at around 700,000–800,000 RMB with gross margins exceeding 65%. Kaige's Class III machine revenue share surged from 4% in 2024 to 20% in 2025, and is expected to continue rising in 2026. Its equipment is already used in NVIDIA B200/H200 module production lines, serving major clients like Foxconn Industrial Internet, Huawei, Quanta, and Wistron.
Summary: In printing, domestic players dominate, and AI servers have significantly boosted profitability in this segment.
2. Pick-and-Place Machines: Mid-to-Low End Catching Up Fast, High-End Still Foreign-Dominated
Pick-and-place machines are the core of SMT, placing components onto boards one by one. China's pick-and-place machine market was approximately 23.2 billion RMB in 2025, accounting for over 40% of the global total. The domestic share of mid-to-high-speed pick-and-place machines has risen from under 25% in 2020 to nearly 40% in 2025—significant progress. Companies like Etone, Luyuan, and Yetang have established a strong foothold in mid-range 3C and LED applications.
However, for high-speed, high-precision pick-and-place machines used in AI servers, the domestic localization rate remains below 10%. This segment is still dominated by overseas brands such as ASMPT, Fuji/Panasonic, and Hanwha. That said, in the more cutting-edge advanced packaging field (e.g., HBM memory, Chiplet stacking), domestic manufacturers are racing to catch up. Taimurui has achieved ultra-high precision of ±0.26 microns. Pulaisi's TCB (Thermal Compression Bonding) equipment is already supplying leading customers in CoWoS and HBM in volume. Quick Intelligent's TCB has passed verification for Huawei's Ascend series.
Summary: For pick-and-place, domestic players are competitive in the mid-to-low end, but high-end AI server motherboards remain dominated by foreign companies. Advanced packaging offers a new breakthrough opportunity for domestic firms.
3. Inspection Equipment: 3D AOI Remains a Weakness, Significant Room for Domestic Substitution
Inspection is divided into two types: SPI (Solder Paste Inspection) and AOI (Automated Optical Inspection).
3D SPI: Domestic products are already quite capable, with mature offerings from Kaige, Jutze, and JT Automation.
3D AOI: The domestic localization rate is only 10%–20%. The high-end market is still controlled by overseas players like Koh Young (South Korea), Omron (Japan), and SAKI (Japan). AI server boards, densely packed with BGA solder joints and tiny components, require 3D inspection for clear visibility, leaving substantial room for domestic substitution.
Summary: Within inspection equipment, 3D AOI is the weakest link for domestic manufacturers and represents a major opportunity in the coming years.
4. Peripheral Equipment (Board Loaders/Unloaders, Conveyors, etc.): Upgraded from "Iron Frames" to "Smart Nodes" Alongside AI Servers
This is where Huidia excels. In the past, board loaders/unloaders and conveyors were seen as simple iron frames for moving boards. But AI servers have changed everything:
Boards are large and heavy (1.2m long, 6mm thick). Traditional belt conveyors tend to sag, causing misalignment in placement coordinates. Modern solutions use servo clamping edges with air-floating support. Board loaders/unloaders must be able to handle heavy loads.
Conveyor precision requirements are high: previously, a positioning error of 1.5mm on a conveyor was acceptable. Now, AI server lines demand ±0.02mm accuracy; otherwise, placement machines cannot position correctly. New-generation smart conveyors use linear motors and grating rulers, achieving significant precision improvements.
Buffer capacity must be large: when the placement machine changes reels or the reflow oven fluctuates, the conveyor must temporarily store 20 or more boards to keep the entire line running without stopping.
Network connectivity is essential: modern "smart manufacturing" lines require conveyors to support SECS/GEM and OPC UA over TSN protocols, enabling communication with placement machines and MES systems. After 2025, equipment not supporting these protocols may become ineligible for government "intelligent transformation and digital upgrade" subsidies.
Anti-static and dust control are critical: automotive electronics and AI server lines have strict ESD and cleanliness requirements. Conveyors must include built-in ion bars for real-time static monitoring.
Domestic landscape for peripheral equipment: Unlike pick-and-place machines, peripheral equipment has always been dominated by domestic manufacturers. Although overseas brands (ASMPT, Panasonic) also offer such products, they are expensive and slow to repair (average 14 days vs. 2–3 days for domestic suppliers). In the sub-150,000 RMB market segment, foreign market share has fallen to single digits. The AI server wave is precisely upgrading peripheral equipment from "cheap iron frames worth tens of thousands" to "smart nodes worth hundreds of thousands," boosting both unit prices and profits.
Summary Table: Domestic Strength by Segment
| Segment | Overall Domestic Share | Performance in High-End AI Server | Representative Domestic Manufacturers |
| Solder Paste Printing | Global #1 (Kaige 21.2%) | Dominant, already in NVIDIA lines | Kaige Precision |
| Mid/Low-Speed Placement | ~40% | Usable, but high-speed segment <10% | Etone, Luyuan, Yetang |
| High-Speed High-Precision Placement | <10% | Overseas dominant (ASMPT/Fuji/Hanwha) | Taimurui (±0.26μm), Pulaisi (TCB) |
| Advanced Packaging (TCB, etc.) | Starting from zero | Breakthrough window, batch orders secured | Taimurui, Pulaisi, Quick Intelligent, Dashi |
| 3D SPI | Relatively high | Usable | Kaige, Jutze, JT Automation |
| 3D AOI | 10%–20% | Weak point, overseas dominant | Huaxing Yuanyuan, Mingrui Ideal, etc. tracking |
| Peripheral Equipment (Board Loaders, etc.) | Domestic dominant | Upgraded with AI large boards, volume & price rising | Huidia, Qiqi, Anda, etc. |
Conclusion
The impact of AI servers on the SMT industry is not about "domestic substitution across all segments." Instead, it's a segmented breakthrough:
Printing: Domestic players have already won and are earning more than before.
Placement: Mid-to-low end is catching up fast; high-end remains overseas territory, but advanced packaging offers new opportunities.
Inspection: 3D AOI is a weak spot with huge potential.
Peripheral Equipment: Riding the whole-line upgrade wave, transforming from iron frames to smart nodes, with unit prices and profits rising.
For peripheral equipment manufacturers like Huidia, the next winners will be those who can simultaneously deliver "±0.02mm precision + OPC UA networking + large-board heavy-load handling" —these three capabilities will capture the biggest slice of the AI server pie.
[Huidia Related Section]
As a national high-tech enterprise specializing in SMT automation intelligent equipment, Huidia Electronics (Dongguan, Chashan) primarily manufactures board loaders/unloaders, conveyors, transfer machines, turners, buffer stations, and corner conveyors. It offers non-standard automation customization capabilities and operates its own sheet metal fabrication process to ensure delivery speed and quality. Products are widely used in consumer electronics, automotive electronics, telecommunications, and industrial control applications.
Addressing the upgrade demands of AI servers and automotive electronics for "large-board heavy-load transport + full-line protocol integration + ESD closed-loop control," Huidia continues to invest in heavy-load adaptation for board loaders/unloaders, dynamic buffering for conveyors, and multi-protocol integration, helping customers smoothly transition from consumer electronics quick-turn lines to high-reliability production lines.
If you are planning an AI server or automotive electronics production line, feel free to contact the Huidia technical team to discuss peripheral equipment configuration solutions.
